Report of the 42th SHM Electronics Packaging Seminar and a Factory Tour.
نویسندگان
چکیده
منابع مشابه
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چکیده ندارد.
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15 صفحه اولEnvironmentally Responsible Electronics Packaging
he United States is running out of T landftlls and that is where most trash, and thus most packaging 1 material, ends up. For example, we generate 180 million tons of solid waste per year, 70% of which goes into landfills. However, in the last 12 years, two-thirds of our landfills have been exhausted. The problem gained national attention in 1989 when a garbage barge from New York wandered acro...
متن کاملHigh Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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ژورنال
عنوان ژورنال: Journal of SHM
سال: 1997
ISSN: 1884-1198,0919-4398
DOI: 10.5104/jiep1993.13.6_36